Why doesn´t the middle of 3 the colour receiving diodes lay in the middle of the package?
Due to a defined chip displacement, there is a displacement of the package middle of 250µm in lengthwise with mounting tolerance of ±50µm. The cause of the displacement is the rear side engage of the chip and the resulting necessity of the area of the leadframes for connecting of the cathode pins to the chip bearing.
Due to a defined chip displacement, there is a displacement of the package middle of 250µm in lengthwise with mounting tolerance of ±50µm. The cause of the displacement is the rear side engage of the chip and the resulting necessity of the area of the leadframes for connecting of the cathode pins to the chip bearing.